Chiyambi: Zovuta Zaukadaulo mu Zamagetsi Zagalimoto ndiCapel's Innovations

Pamene kuyendetsa pawokha kumapita ku L5 ndi makina oyendetsa mabatire agalimoto yamagetsi (EV) (BMS) amafuna mphamvu zochulukirapo komanso chitetezo, matekinoloje achikhalidwe a PCB amalimbana kuthana ndi zovuta:

• Zowopsa Zothamangitsidwa ndi Thermal: ECU chipsets kuposa 80W mphamvu yogwiritsira ntchito, ndi kutentha komweko kumafika 150 ° C
• 3D Integration Malire: BMS imafuna 256+ njira zowonetsera mkati mwa makulidwe a bolodi a 0.6mm
• Kulephera Kugwedezeka: Masensa odziyimira pawokha amayenera kupirira kugwedezeka kwamakina 20G
• Zofuna za Miniaturization: Olamulira a LiDAR amafuna 0.03mm kufufuza m'lifupi ndi 32-wosanjikiza stacking

Capel Technology, yomwe ikuthandizira zaka 15 za R&D, imabweretsa njira yosinthira kuphatikizamkulu matenthedwe madutsidwe PCBs(2.0W/mK),ma PCB osamva kutentha kwambiri(-55°C~260°C),ndi32-wosanjikizaHDI anakwiriridwa/akhungu kudzera muukadaulo(0.075mm microvias).

Gawo 1: Thermal Management Revolution for Autonomous Driving ECUs

1.1 Zovuta za ECU Thermal

• Nvidia Orin chipset kutentha flux kachulukidwe: 120W/cm²
• Magawo ochiritsira a FR-4 (0.3W/mK) amayambitsa kutentha kwa 35%
• 62% ya zolephera za ECU zimachokera ku kutopa kwa solder chifukwa cha kutentha kwa thupi

1.2 Tekinoloje ya Capel's Thermal Optimization Technology

Zakuthupi Zatsopano:

• Nano-aluminium reinforced polyimide substrates (2.0±0.2W/mK matenthedwe matenthedwe)
• 3D mizati yamkuwa yamkuwa (400% yowonjezera kutentha kutentha)

Zopita patsogolo:

• Laser Direct Structuring (LDS) kuti muthe kukhathamiritsa njira zotentha
• Kuyika kophatikizana: 0.15mm mkuwa wowonda kwambiri + 2oz zigawo zamkuwa zolemera

Kufananiza Magwiridwe:

Gawo 2: BMS Wiring Revolution yokhala ndi 32-Layer HDI Technology

2.1 Zowawa Zamakampani mu BMS Design

• Mapulatifomu a 800V amafuna 256+ njira zowunikira ma cell voltage
• Mapangidwe anthawi zonse amapitilira malire a danga ndi 200% ndi 15% yosagwirizana ndi zopinga

2.2 Mayankho a Capel's High-Density Interconnect Solutions

Stackup Engineering:

• 1+N+1 mtundu uliwonse wa HDI (zigawo 32 pa makulidwe a 0.035mm)
• ± 5% kuwongolera kosiyana kosiyana (10Gbps ma siginecha othamanga)

Microvia Technology:

• 0.075mm laser-blind vias (12:1 mawonekedwe)
• <5% plating void rate (IPC-6012B Class 3 yogwirizana)

Zotsatira za Benchmark:

Gawo 3: Kudalirika Kwambiri Kwachilengedwe - Mayankho Otsimikizika a MIL-SPEC

3.1 Kutentha Kwambiri Kwazinthu

• Glass Transition Temp (Tg): 280°C (IPC-TM-650 2.4.24C)
• Kuwola Kutentha (Td): 385°C (5% kuwonda)
• Kupulumuka Kwakantha Kwambiri: Kuzungulira kwa 1,000 (-55°C↔260°C)

3.2 Proprietary Protection Technologies

• Kupaka polima wopangidwa ndi plasma (1,000h kukana kupopera mchere)
• 3D EMI zotchinga ma cavities (60dB attenuation @10GHz)

Gawo 4: Nkhani Yophunzira - Mgwirizano ndi Global Top 3 EV OEM

4.1 800V BMS Control Module

• Chovuta: Phatikizani 512-channel AFE mu 85 × 60mm danga
• Yankho:
  1. PCB-wosanjikiza 20 (3mm bend radius)
  2. Netiweki yolumikizidwa ya sensor kutentha (0.03mm kutsata m'lifupi)
  3. Kuziziritsa kwachitsulo-pakati (0.15°C·cm²/W kukana kutentha)

4.2 L4 Autonomous Domain Controller

• Zotsatira:
  • 40% kuchepetsa mphamvu (72W → 43W)
  • Kuchepetsa kukula kwa 66% motsutsana ndi mapangidwe ochiritsira
  • Chitsimikizo chachitetezo cha ASIL-D

Gawo 5: Zitsimikizo ndi Chitsimikizo Chabwino

Dongosolo labwino la Capel limaposa miyezo yamagalimoto:

• Chitsimikizo cha MIL-SPEC: Zogwirizana ndi GJB 9001C-2017
• Kutsata Magalimoto: IATF 16949: 2016 + AEC-Q200 kutsimikiziridwa
• Mayeso odalirika:
  • 1,000h HAST (130°C/85% RH)
  • 50G mechanical shock (MIL-STD-883H)

Kutsiliza: Next-Gen PCB Technology Roadmap

Capel akuchita upainiya:

• Zida zophatikizika (30% zosungira malo)
• Optoelectronic hybrid PCBs (0.2dB/cm kutaya @850nm)
• Makina a DFM oyendetsedwa ndi AI (15% zokolola zabwino)

Lumikizanani ndi gulu lathu la engineeringlero kuti mugwirizane kupanga njira zosinthira za PCB zamagalimoto anu am'badwo wotsatira.