Mau oyamba amawunika momwe kutuluka kwa multilayer HDI PCBs kwasinthira makampani opanga zamagetsi
ndikuthandizira kupita patsogolo kwatsopano.
M'malo othamanga kwambiri a zamagetsi zamagetsi, kutsogola ndiye chinsinsi chopitilira patsogolo. Kutuluka kwa ma multilayer high-density interconnect (HDI) osindikizira ma circuit board (PCBs) kwasintha makampani, kupereka zabwino zambiri zomwe sizingafanane ndi ma board achikhalidwe. Kuchokera ku zida za IoT kupita ku zomangamanga za 5G, ma PCB a HDI amitundu yambiri amatenga gawo lalikulu pakukonza tsogolo lazamagetsi zamagetsi.
Ndi chiyaniMultilayer HDI PCB? Imawulula zovuta zaukadaulo komanso kapangidwe kapamwamba ka ma PCB ambiri a HDI ndi mawonekedwe awo enieni
kufunikira kwa mapulogalamu apakompyuta apamwamba kwambiri.
Ma PCB a Multilayer HDI ndi ma board otsogola mwaukadaulo omwe amakhala ndi zigawo zingapo zamkuwa wowongolera, womwe nthawi zambiri amakhala pakati pa zigawo za insulating substrate material. Ma board ozungulira ovutawa amapangidwa kuti azigwiritsidwa ntchito kwambiri pamagetsi, makamaka pankhani yamagetsi olumikizirana.
Zofunika Kwambiri ndi Zopangira Zinthu :Kusanthula kwatsatanetsatane ndi zolemba zomwe zimapanga
multilayer HDI PCBs njira yabwino yolumikizirana zamagetsi.
Ma PCB a Multilayer HDI omwe amagwiritsidwa ntchito pazamagetsi zamagetsi amagwiritsa ntchito polyimide (PI) kapena FR4 ngati maziko, kuphatikiza mkuwa ndi zomatira kuti zitsimikizire kukhazikika ndi magwiridwe antchito. Mzere wa 0.1mm m'lifupi ndi matayala amapereka kulondola kosayerekezeka ndi kudalirika kwa mapangidwe ovuta a dera. Ndi makulidwe a bolodi a 0.45mm +/- 0.03mm, ma PCB awa amapereka malire abwino pakati pa compactness ndi ruggedness, kuwapanga kukhala abwino kwa zida zolumikizirana zopanda malo.
Kabowo kakang'ono ka 0.1 mm kumawunikiranso luso lapamwamba lopanga ma PCB amitundu yambiri a HDI, zomwe zimathandizira kuphatikiza zida zomangika. Kukhalapo kwa akhungu ndi kukwiriridwa vias (L1-L2, L3-L4, L2-L3) komanso yokutidwa dzenje kudzaza osati facilitates zovuta interconnects komanso kumawonjezera lonse chizindikiro kukhulupirika ndi kudalirika kwa bolodi.
Surface Treatment - Game Changer ikuwonetsa kufunikira kwa chithandizo chapamwamba cha nickel immersion gold (ENIG) ndi momwe zimakhudzira kutumiza ma siginecha ndi mphamvu zolandirira pamagetsi olumikizirana.
Electroless Nickel Immersion Gold (ENIG) chithandizo chapamwamba pamtunda wa 2-3uin chimapereka zokutira zoteteza zomwe zimatsimikizira kusungunuka kwabwino komanso kukana dzimbiri. Chithandizo chapamwambachi ndi chofunikira kwambiri pankhani yamagetsi olumikizirana. Kuchita kwa PCB kumakhudza mwachindunji kufalikira kwa siginecha ndi kuthekera kolandila kwa chipangizocho.
Mapulogalamu mu Communication Electronics amapereka kuyang'ana mozama pamagwiritsidwe osiyanasiyana a ma multilayer HDI PCBs mu 5G.
zomangamanga, zida za IoT ndi zovala, zida zoyankhulirana, ndi njira zoyankhulirana zamagalimoto.
Chimodzi mwazinthu zochititsa chidwi kwambiri za multilayer HDI PCBs ndi kugwiritsa ntchito kwawo mosiyanasiyana pazamagetsi zamagetsi. Ma PCB awa ndi msana wa zida ndi machitidwe osiyanasiyana, omwe amagwira ntchito yofunika kwambiri pothandizira kulumikizana kosasunthika ndi magwiridwe antchito. Tiyeni tifufuze zina mwazofunikira zomwe ma multilayer HDI PCB akukonzanso mawonekedwe amagetsi olumikizirana.
Revolutionary Impact ikufotokoza momwe ma multilayer HDI PCBs akusinthira mawonekedwe a zamagetsi, kupereka
kusinthasintha kwapangidwe kosayerekezeka, kukulitsa kukhulupirika kwa chizindikiro ndi kudalirika, ndikuyendetsa kusintha kwa 5G.
Kusintha kwa teknoloji ya 5G kwafotokozeranso zofunikira pazitukuko zoyankhulirana, zomwe zimafuna kuthamanga kwapamwamba kwa deta komanso kuchita bwino kwambiri. Multilayer HDI PCB imapereka nsanja yabwino yophatikizira zinthu zambiri komanso kutumizira ma siginecha othamanga kwambiri, zomwe ndizofunikira kwambiri kuti zitheke kuyika zida za 5G. Kukhoza kwawo kuthandizira ma siginecha othamanga kwambiri komanso othamanga kwambiri kumawapangitsa kukhala ofunikira kwambiri popanga masiteshoni oyambira a 5G, tinyanga ndi zinthu zina zofunika kwambiri.
Zida za IoT ndi zovala
Kuchulukirachulukira kwa zida zapaintaneti ya Zinthu (IoT) ndi zobvala zimafunikira zida zamagetsi zolimba koma zamphamvu. Ma PCB a Multilayer HDI ndiwothandizira kuti azitha kupanga zatsopano pankhaniyi, ndikuwongolera chitukuko cha zida zapamwamba za IoT ndi zovala zokhala ndi mawonekedwe ake ophatikizika komanso kulumikizana kwakukulu. Kuchokera pazida zam'nyumba zanzeru kupita ku zowunikira zaumoyo zovala, ma PCBwa amathandizira kubweretsa tsogolo lamagetsi olumikizirana.
Zipangizo zamatelefoni
M'gawo loyankhulirana komwe kudalirika ndi magwiridwe antchito sizingasokonezedwe, mitundu ingapo ya HDI PCB imakhala yankho la chisankho. Pothandizira kuphatikiza kosagwirizana kwa njira zolumikizirana zovuta, kukonza ma siginecha ndi kasamalidwe ka mphamvu, ma PCBwa amapanga maziko a zida zoyankhulirana zogwira ntchito kwambiri. Kaya ndi rauta, modemu kapena seva yolumikizirana, ma PCB ambiri osanjikiza a HDI amapanga msana wa zigawo zofunikazi.
Njira yolumikizirana yamagalimoto
Pamene makampani amagalimoto akusintha paradigm kupita ku magalimoto olumikizidwa komanso odziyimira pawokha, kufunikira kwa njira zolumikizirana zolimba komanso zodalirika zakula. ma PCB angapo a HDI ndi ofunikira pakuzindikira masomphenya a makina olumikizidwa amagalimoto, kuthandizira kukhazikitsidwa kwa njira zotsogola zoyendetsera madalaivala (ADAS), kulumikizana kwagalimoto ndigalimoto (V2V) ndi kachitidwe ka infotainment m'galimoto. Kulumikizana kwamphamvu kwambiri komanso mawonekedwe ophatikizika operekedwa ndi ma PCBwa amathandizira kukwaniritsa malo okhwima komanso zofunikira pazamagetsi zamagetsi zamagalimoto.
Kusintha kwamphamvu
Kuwonekera kwa mitundu ingapo ya HDI PCB kwabweretsa kusintha kwamalingaliro pakupanga, kupanga ndi magwiridwe antchito amagetsi olumikizirana. Kukhoza kwawo kuthandizira mapangidwe ovuta, ma siginecha apamwamba kwambiri komanso mawonekedwe ophatikizika amatsegula mwayi wopanda malire, kulola opanga ndi mainjiniya kukankhira malire aukadaulo. Udindo wa ma PCBwa umakhudza ntchito zosiyanasiyana monga zomangamanga za 5G, zipangizo za IoT, mauthenga a telefoni ndi magalimoto, ndipo zakhala gawo lofunika kwambiri pakupanga tsogolo lamagetsi oyankhulana.
Revolutionizing Design Flexibility imafotokoza momwe ukadaulo wa multilayer HDI PCB umamasulira opanga ku malire a
ma PCB achikhalidwe, kuwalola kupanga zida zoyankhulirana za m'badwo wotsatira zomwe zili ndi zida zowonjezera komanso luso.
Ukadaulo wozungulira wamitundu ingapo wa HDI umamasula opanga ku zopinga za PCB zachikhalidwe, kupereka kusinthasintha kwapangidwe kosayerekezeka ndi ufulu. Kutha kuphatikizira zigawo zingapo zamayendedwe owongolera ndi ma vias mu malo ophatikizika sikungochepetsa gawo lonse la PCB komanso kumathandizira mapangidwe ovuta, ochita bwino kwambiri. Kusinthasintha kwatsopano kumeneku kumathandizira kupanga zida zoyankhulirana za m'badwo wotsatira, kulola kuti zinthu zambiri ndi magwiridwe antchito azilowetsedwa muzinthu zing'onozing'ono, zogwira mtima kwambiri.
Kupititsa patsogolo Kukhulupirika kwa Signal ndi Kudalirika kumawunikira gawo lofunikira la ma multilayer HDI PCBs popereka chizindikiro chapamwamba.
kukhulupirika ndikuchepetsa kutayika kwa ma sign, crosstalk, ndi kusagwirizana kwamagetsi pamagetsi olumikizirana.
Pankhani yamagetsi olumikizirana, kukhulupirika kwazizindikiro ndikofunikira kwambiri. Multilayer HDI PCBs adapangidwa kuti azipereka kukhulupirika kwazizindikiro pochepetsa kutayika kwa ma sign, crosstalk ndi impedance mismatch. Kuphatikizika kwa ma vias akhungu ndi okwiriridwa, kuphatikizidwa ndi kutalika kwa mizere yolondola komanso katayanidwe kake, kumatsimikizira kuti ma siginecha othamanga kwambiri amadutsa pa PCB mosasokoneza pang'ono, kutsimikizira kulumikizana kodalirika ngakhale pamapulogalamu ovuta kwambiri. Mulingo uwu wa kukhulupirika kwa chizindikiro ndi kudalirika kumalimbitsa ma board ozungulira a multilayer HDI ngati chinsinsi chamagetsi amakono olumikizirana.
Kuyendetsa 5G Revolution kumawulula gawo lofunikira la ma PCB amitundu yambiri a HDI pothandizira maukonde othamanga kwambiri, otsika kwambiri a 5G.
ndi kutumizidwa kwa zomangamanga.
Kutumizidwa kwa teknoloji ya 5G kumadalira kupezeka kwa zipangizo zamakono zoyankhulirana. Multilayer HDI PCBs akhala msana wa zomangamanga za 5G ndipo amagwira ntchito yofunika kwambiri pothandizira kutumizidwa kwa maukonde othamanga kwambiri, otsika kwambiri. Kukhoza kwawo kuthandizira kusakanikirana kwakukulu kwa zigawo zikuluzikulu, zizindikiro zothamanga kwambiri komanso kugwirizanitsa zovuta kumathandizira kupanga malo oyambira a 5G, antennas ndi zigawo zina zofunika zomwe zimapanga mwala wapangodya wa mauthenga a 5G. Popanda mphamvu zoperekedwa ndi ma multilayer HDI circuit boards, kuzindikira kuthekera kwa 5G kudzakhalabe zenizeni zakutali.
Multilayer HDI PCB Production process
Malingaliro Omaliza, kulingalira za kusintha kwa ma PCB a HDI amitundu yambiri komanso gawo lawo losatha pakupanga tsogolo la
kulumikizana ndi kulumikizana muzaka za digito.
Kukula kwaukadaulo waukadaulo wamagetsi olumikizirana kumalumikizana modabwitsa ndi kupita patsogolo kwaukadaulo wamitundu yambiri wa HDI PCB. Sikuti ma PCBwa akungofotokozeranso zomwe zingatheke pakupanga, kulumikizana ndi magwiridwe antchito, akutseguliranso njira zamaukadaulo osinthika monga 5G, IoT ndi magalimoto olumikizidwa. Pomwe kufunikira kwa zida zamagetsi zamagetsi zowoneka bwino, zowoneka bwino kwambiri zikupitilirabe, ma PCB ambiri a HDI amakhalabe patsogolo pakuyendetsa zatsopano ndikuyendetsa mayendedwe otsatirawa. Kusintha kwawo pamagetsi olumikizirana sikungatsutse, ndipo gawo lawo popanga tsogolo la kulumikizana ndi kulumikizana lipitilira zaka zikubwerazi.
Nthawi yotumiza: Jan-25-2024
Kubwerera