Zigawo zazikulu za Multilayer FPC PCB

Multilayer flexible printed circuit boards (FPC PCBs) ndi zigawo zofunika kwambiri zomwe zimagwiritsidwa ntchito pazida zosiyanasiyana zamagetsi, kuchokera ku mafoni a m'manja ndi mapiritsi kupita ku zipangizo zamankhwala ndi makina amagalimoto. Ukadaulo wapamwambawu umapereka kusinthasintha kwakukulu, kukhazikika komanso kutumizira ma siginecha koyenera, kupangitsa kuti ikhale yofunidwa kwambiri m'dziko lamakono lamakono la digito.Mu positi iyi yabulogu, tikambirana zigawo zazikulu zomwe zimapanga FPC PCB yambiri komanso kufunikira kwake pakugwiritsa ntchito pakompyuta.

1. Gawo laling'ono losinthika:

Flexible substrate ndiye maziko a multilayer FPC PCB.Amapereka kusinthasintha kofunikira komanso kukhulupirika kwamakina kuti athe kupirira kupindika, kupindika ndi kupindika popanda kusokoneza magwiridwe antchito amagetsi. Nthawi zambiri, zida za polyimide kapena poliyesitala zimagwiritsidwa ntchito ngati gawo lapansi chifukwa cha kukhazikika kwawo kwamafuta, kutsekemera kwamagetsi, komanso kuthekera koyenda mwamphamvu.

2. Conductive layer:

Ma conductive zigawo ndizofunikira kwambiri za multilayer FPC PCB chifukwa zimathandizira kuyenda kwa ma siginecha amagetsi muderali.Zigawozi nthawi zambiri zimapangidwa ndi mkuwa, womwe umakhala ndi mphamvu yabwino kwambiri yamagetsi komanso kukana dzimbiri. Chojambulacho chamkuwa chimapangidwa ndi laminated ku gawo lapansi losinthika pogwiritsa ntchito zomatira, ndipo njira yotsatsira yotsatizana imapangidwa kuti ipange mawonekedwe ofunikira adera.

3. Insulation layer:

Zigawo zotchingira, zomwe zimadziwikanso kuti zigawo za dielectric, zimayikidwa pakati pa zigawo zowongolera kuti ziteteze akabudula amagetsi ndikupereka kudzipatula.Amapangidwa ndi zinthu zosiyanasiyana monga epoxy, polyimide kapena solder mask, ndipo amakhala ndi mphamvu zambiri za dielectric komanso kukhazikika kwamafuta. Zigawo izi zimagwira ntchito yofunika kwambiri posunga kukhulupirika kwa ma sign ndi kupewa kuphatikizika pakati pa njira zotsatsira.

4. Chigoba cha Solder:

Chigoba cha Solder ndi gawo lodzitchinjiriza lomwe limagwiritsidwa ntchito pazigawo zoyendetsera ndi zotsekera zomwe zimalepheretsa mabwalo afupiafupi panthawi yowotchera ndikuteteza mikwingwirima yamkuwa kuzinthu zachilengedwe monga fumbi, chinyezi, ndi okosijeni.Nthawi zambiri zimakhala zobiriwira koma zimathanso kubwera mumitundu ina monga yofiira, yabuluu kapena yakuda.

5. Kukuta:

Coverlay, yemwe amadziwikanso kuti filimu yophimba kapena filimu yophimba, ndi wosanjikiza wotetezera wogwiritsidwa ntchito kunja kwa multilayer FPC PCB.Amapereka zowonjezera zowonjezera, chitetezo cha makina ndi kukana chinyezi ndi zonyansa zina. Zotchingira nthawi zambiri zimakhala ndi mipata yoyikapo zinthu komanso kulola kuti pakhale ma pads mosavuta.

6. Kupaka mkuwa:

Copper plating ndi njira yopangira electroplating kagawo kakang'ono ka mkuwa pagawo loyendetsa.Njirayi imathandizira kukonza madulidwe amagetsi, kuchepetsa kutsekeka, komanso kupititsa patsogolo kukhulupirika kwa ma multilayer FPC PCBs. Copper plating imathandizanso kuti pakhale mayendedwe owoneka bwino a mabwalo okhala ndi kachulukidwe kwambiri.

7. Kudzera:

Kudzera ndi kabowo kakang'ono komwe kamabowoledwa kupyola mu zigawo zamitundu yambiri ya FPC PCB, kulumikiza magawo amodzi kapena angapo palimodzi.Amalola kulumikizana koyima ndikuwongolera ma siginecha pakati pa zigawo zosiyanasiyana za dera. Vias nthawi zambiri wodzazidwa ndi mkuwa kapena conductive phala kuonetsetsa odalirika kugwirizana magetsi.

8. Mapadi azinthu:

Mapadi a zigawo ndi madera omwe ali pa multilayer FPC PCB yopangidwira kulumikiza zida zamagetsi monga ma resistors, capacitors, ma frequency ophatikizika, ndi zolumikizira.Mapadi awa nthawi zambiri amapangidwa ndi mkuwa ndipo amalumikizidwa ndi njira zomwe zimapangidwira pogwiritsa ntchito solder kapena zomatira zopangira.

Powombetsa mkota:

A multilayer flexible printed circuit board (FPC PCB) ndi dongosolo lovuta lopangidwa ndi zigawo zingapo zofunika.Magawo osinthika, ma conductive layers, insulating layers, solder masks, overlayings, copper plating, vias and component pads amagwirira ntchito limodzi kuti apereke kulumikizana kofunikira kwamagetsi, kusinthasintha kwamakina ndi kukhazikika komwe kumafunikira ndi zida zamakono zamakono. Kumvetsetsa zigawo zazikuluzikuluzi kumathandizira kupanga ndi kupanga ma PCB apamwamba kwambiri a FPC omwe amakwaniritsa zofunikira zamafakitale osiyanasiyana.