Mastering High-Speed ​​​​Digital Signals HDI PCB Prototyping

Tsegulani:

Takulandilani kubulogu ya Capel, komwe cholinga chathu ndikupereka chiwongolero chokwanira cha ma HDI PCBs pogwiritsa ntchito ma siginecha othamanga kwambiri.Pokhala ndi zaka 15 zopanga ma board board, gulu lathu lodzipereka la akatswiri litha kukuthandizani kuyang'ana zovuta za prototyping ndi kupanga.Timapereka ntchito zaukadaulo zogulitsa kale komanso zotsatsa pambuyo pogulitsa kuti zitsimikizire kukhutitsidwa kwamakasitomala.M'nkhaniyi, tiona zovuta za HDI PCB prototyping, kuwonetsa kufunikira kwa ma sigino a digito othamanga kwambiri, ndikupereka zidziwitso zamtengo wapatali kukuthandizani kuchita bwino m'munda.

Gawo 1: Kumvetsetsa Zotsatira za HDI PCB Prototyping

Kuti tikwaniritse magwiridwe antchito ndi magwiridwe antchito, ndikofunikira kumvetsetsa kufunikira kwa HDI PCB prototyping pamapulogalamu apamwamba kwambiri a digito.Ma PCB a High-density interconnect (HDI) amapangidwa kuti athe kukhala ndi zigawo zingapo ndi zozungulira zovuta, potero zimakulitsa kukhulupirika kwa ma sign, kuchepetsa kusokoneza, ndikuwongolera magwiridwe antchito amagetsi.Zinthuzi zimakhala zofunika kwambiri pokonza ma siginecha othamanga kwambiri, pomwe ngakhale kusokoneza pang'ono kapena kusokoneza ma siginecha kungayambitse katangale kapena kutayika kwa data.

Gawo 2: Mfundo zazikuluzikulu za Prototyping HDI PCBs

2.1 Design for Manufacturability (DfM)
Design for Manufacturability (DfM) imakhala ndi gawo lofunikira pakujambula kwa HDI PCB.Kugwira ntchito limodzi ndi opanga ma board panthawi yoyambira malingaliro amalola kuphatikizika kosasunthika kwa mapangidwe apangidwe ndi kuthekera kopanga.Pophatikizira mfundo za DfM monga kukhathamiritsa m'lifupi mwake, kusankha zida zoyenera, ndikuganizira zoyikapo, mutha kuchepetsa zovuta zomwe zingachitike popanga ndikuchepetsa ndalama zonse.

2.2 Kusankha zinthu
Kusankha zida zoyenera zama prototypes a HDI PCB ndikofunikira kuti mukwaniritse magwiridwe antchito amagetsi komanso kudalirika.Zida zokhala ndi dielectric zokhazikika, zowongolera zowongolera, komanso mawonekedwe abwino kwambiri ofalitsa ma siginecha ziyenera kufunidwa.Kuphatikiza apo, ganizirani kugwiritsa ntchito ma laminate apadera othamanga kwambiri kuti muwongolere mwamphamvu kukhulupirika kwa siginecha ndikuchepetsa kutayika kwa chizindikiro.

2.3 Mapangidwe a stackup ndi kukhulupirika kwa chizindikiro
Kukonzekera koyenera kwa stackup kumatha kukhudza kwambiri kukhulupirika kwa chizindikiro ndi magwiridwe antchito onse.Kuyika kwa masanjidwe, makulidwe amkuwa, ndi makulidwe a dielectric ziyenera kukonzedwa mosamala kuti muchepetse kufalikira, kutayika kwa ma siginecha, ndi kusokoneza kwamagetsi.Kugwiritsa ntchito ukadaulo wowongolera wa impedance ndikumatsatira miyezo yamakampani kumathandizira kusunga kukhulupirika kwazizindikiro ndikuchepetsa zowunikira.

Gawo 3: HDI PCB Prototyping Technology

3.1 Kubowola laser kwa Microhole
Ma Microvias ndi ofunikira kuti akwaniritse zozungulira kwambiri mu HDI PCBs ndipo amatha kupangidwa bwino pogwiritsa ntchito ukadaulo wakubowola laser.Kubowola kwa laser kumathandizira kuwongolera moyenera kukula, kuchuluka kwa mawonekedwe ndi kukula kwa pad, kuonetsetsa kulumikizana kodalirika ngakhale pazifukwa zazing'ono.Kugwira ntchito ndi wopanga PCB wodziwa zambiri ngati Capel kumatsimikizira kuchitidwa molondola kwa njira yovuta ya kubowola laser.
3.2 Lamination motsatizana
Sequential lamination ndiukadaulo wofunikira womwe umagwiritsidwa ntchito mu HDI PCB prototyping process ndipo umaphatikizapo kuyika magawo angapo palimodzi.Izi zimapangitsa kuti pakhale njira zolimba, kuchepetsa kutalika kwa kulumikizana, komanso kuchepetsa ma parasitic.Pogwiritsa ntchito matekinoloje atsopano opangira ma lamination monga Build-Up Process (BUP), mutha kukwaniritsa kachulukidwe kopitilira muyeso popanda kusokoneza kukhulupirika kwa chizindikiro.

Gawo 4: Zochita Zabwino Kwambiri pa Kukhulupirika kwa Chizindikiro Chapamwamba Kwambiri

4.1 Kuwongolera kwa Impedans ndi kusanthula kukhulupirika kwa chizindikiro
Kukhazikitsa njira zowongolera za impedance monga zowongolera zowongolera ndi kufananiza kwa impedance ndikofunikira kuti musunge kukhulupirika kwa ma siginecha pamapangidwe apamwamba kwambiri a digito.Zida zoyeserera zapamwamba zitha kukuthandizani kusanthula kukhulupirika kwa ma siginecha, kuzindikira zosintha zomwe zingachitike, ndikuwongolera masanjidwe a PCB moyenerera.

4.2 Malangizo Opangira Ma Signal Integrity
Kutsatira malangizo amakampani opanga ma siginecha othamanga kwambiri kumatha kupititsa patsogolo magwiridwe antchito amtundu wanu wa HDI PCB.Zochita zina kukumbukira ndi kuchepetsa discontinuities, optimizing kubwerera njira, ndi kuchepetsa chiwerengero cha vias m'madera mkulu-liwiro.Kugwira ntchito limodzi ndi gulu lathu lodziwa za kafukufuku ndi chitukuko kungakuthandizeni kutsatira malangizowa moyenera.

Pomaliza:

Ma Prototyping HDI PCBs pogwiritsa ntchito ma siginecha othamanga kwambiri amafunikira kusamalitsa mwatsatanetsatane.Pogwiritsa ntchito luso la Capel komanso luso lake, mutha kusintha njira, kuchepetsa kuopsa kwa kupanga ndikupeza zotsatira zabwino.Kaya mukufuna prototyping mwachangu kapena kupanga voliyumu, malo athu opanga ma board ozungulira amatha kukwaniritsa zomwe mukufuna.Lumikizanani ndi gulu lathu la akatswiri lero kuti mupeze mpikisano m'dziko lothamanga kwambiri la HDI PCB yopanga ma siginecha othamanga kwambiri.